RT RadiographyASMEAPI

Radiographic Testing Procedure Writing: Complete RT Compliance Guide

A complete guide to writing ASME Section V Article 2 and API-compliant RT procedures — source selection, IQI calculation, geometric unsharpness, film density requirements, viewing conditions, and the most frequently failed RT elements.

NDTVerify Editorial··10 min read
Source
Selection
kV range + thickness limits
IQI + Ug
Calculation
Geometric unsharpness limits
2.0–4.0
Film Density
ASME T-282 requirement
Viewing
Conditions
Illuminator + ambient light

Why RT Procedures Fail Review More Than Any Other Method

Radiographic testing procedures are the most technically complex single-method procedures in the NDT portfolio. They span radiation physics (source activity, energy, geometric unsharpness), film science (speed class, density, contrast), equipment specifications (SFD, IQI), and safety (radiological control, exposure calculations). A complete RT procedure touches all of these — and gaps in any area result in rejection.

RT procedures also face scrutiny from two directions: the NDT client (checking technical compliance with ASME/API) and the Radiation Protection Supervisor or regulatory body (checking radiation safety compliance). This guide covers the NDT compliance side.

Applicable Standards

Radiation Source Specification

Your procedure must identify the radiation source with enough detail to confirm it is appropriate for the material thickness being examined. Required elements:

Source Selection Table (ASME T-233.1): If you are using Ir-192 on material outside the 10–100 mm range, or Co-60 on thin sections, your procedure must include a justification or the review will fail. Many procedures simply list the source without confirming the applicable thickness range.

Geometric Unsharpness (Ug) Calculation

This is one of the most frequently absent elements in RT procedures. ASME Section V T-285 requires that geometric unsharpness be calculated and limited. The formula is:

Ug = (f × d) / D
Where: f = source size (mm), d = source-to-object distance (mm), D = source-to-film distance (mm)

ASME maximum Ug limits per T-285:

Material ThicknessMaximum Ug
Under 50.8 mm (2 in.)0.51 mm (0.020 in.)
50.8 mm to 88.9 mm (2–3.5 in.)0.76 mm (0.030 in.)
88.9 mm to 114.3 mm (3.5–4.5 in.)1.02 mm (0.040 in.)
Over 114.3 mm (4.5 in.)1.78 mm (0.070 in.)

Your procedure must either provide the Ug calculation for the examination setup, or provide a nomograph reference. Stating "SFD = 700 mm" without confirming the resulting Ug is compliant is insufficient.

IQI (Image Quality Indicator) Requirements

IQI selection, placement, and required sensitivity are among the most detailed requirements in any RT procedure. ASME T-276 through T-283 cover this extensively.

IQI Type Selection

IQI Placement

Your procedure must specify IQI placement per ASME T-277:

Required IQI Sensitivity

ASME Table T-276 specifies the required essential hole and designated hole (hole-type IQI) or essential wire (wire-type IQI) that must be visible on the radiograph. Your procedure must state the required sensitivity explicitly — not just "per ASME Table T-276" but the actual hole size or wire diameter required for your thickness range.

Film and Processing Requirements

Viewing Conditions

A frequently omitted element. ASME T-283 requires specific viewing conditions:

Most Common RT Procedure Non-Compliances

  1. Ug calculation absent — SFD stated but geometric unsharpness not calculated or compared to ASME maximum
  2. IQI sensitivity not stated in measurable terms — "IQI per ASME Table T-276" without specifying the required wire or hole for the examined thickness
  3. Source activity range not stated — Ir-192 listed as source but no activity range or applicable thickness range confirmed
  4. Film density range missing — Procedure does not state the required density range (2.0–4.0)
  5. Film-side IQI not justified — Film-side placement used without stating the reason and the sensitivity penalty acknowledgement
  6. Viewing conditions absent — No statement of illuminator luminance or ambient light requirements
  7. Processing conditions incomplete — "Develop per manufacturer recommendations" without specifying temperature and time, or automatic processor settings

Check Your RT Procedure Against ASME Article 2

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